SEMI 3D10 : 2014(R2020)
Current
Current
The latest, up-to-date edition.
Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack
Available format(s)
Hardcopy
Language(s)
English
Published date
01-04-2020
Important note : Users cannot be edited or removed once added to your Multi user PDF.This Guide is intended to address the needs of the 3D Stacked IC (3DS-IC) industry by providing the tools needed to procure processed wafers to be used in a 3DS-IC process.
| DocumentType |
Standard
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| Pages |
0
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| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Current
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| Supersedes |
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