SEMI 3D11:2014(R2020)
Current
Current
The latest, up-to-date edition.
Terminology for Through Glass Via and Blind Via in Glass Geometrical Metrology
Available format(s)
Hardcopy
Language(s)
English
Published date
01-04-2020
Important note : Users cannot be edited or removed once added to your Multi user PDF.This Document attempts to describe measurands and geometrical features of through and blind vias in glass.
| DocumentType |
Standard
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| Pages |
0
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| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| Supersedes |
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