SEMI 3D15:2016(R2022)
Current
Current
The latest, up-to-date edition.
Guide for Overlay Performance Assessment for 3DS-IC Process
Available format(s)
Hardcopy
Language(s)
English
Published date
01-11-2022
This Guide will assist the user in conducting the overlay performance assessment for the face to back (F2B) and face to face (F2F) wafer in 3DS-IC process.
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