SEMI 3D4:2024
Current
Current
The latest, up-to-date edition.
Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks
Available format(s)
Hardcopy
Language(s)
English
Published date
01-09-2024
€150.00
Excluding VAT
This Guide provides a description of tools that can be used to determine these key parameters before, during, and after the process steps involved in wafer bonding.
| DocumentType |
Guide
|
| Pages |
0
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| Supersedes |
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