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SEMI 3D4:2024

Current

Current

The latest, up-to-date edition.

Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks

Available format(s)

Hardcopy

Language(s)

English

Published date

01-09-2024

€161.52
Excluding VAT

This Guide provides a description of tools that can be used to determine these key parameters before, during, and after the process steps involved in wafer bonding.

DocumentType
Guide
Pages
0
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current
Supersedes

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