SEMI 3D5 : 2014(R2018)
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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GUIDE FOR METROLOGY TECHNIQUES TO BE USED IN MEASUREMENT OF GEOMETRICAL PARAMETERS OF THROUGH-SILICON VIAS (TSVS) IN 3DS-IC STRUCTURES
Superseded date
11-03-2024
Superseded by
Published date
28-07-2013
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Specifies on the geometrical parameters of the openings (i.e., holes) in thin silicon slices, within which the conductive vias will be constructed.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (07/2013)
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| DocumentType |
Revision
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| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Superseded
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| SupersededBy |
| SEMI M59 : 2014 | TERMINOLOGY FOR SILICON TECHNOLOGY |
| SEMI MF1530 : 2007(R2018) | TEST METHOD FOR MEASURING FLATNESS, THICKNESS, AND TOTAL THICKNESS VARIATION ON SILICON WAFERS BY AUTOMATED NON-CONTACT SCANNING |
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