SEMI 3D5 : 2014(R2018)
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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GUIDE FOR METROLOGY TECHNIQUES TO BE USED IN MEASUREMENT OF GEOMETRICAL PARAMETERS OF THROUGH-SILICON VIAS (TSVS) IN 3DS-IC STRUCTURES
Superseded date
11-03-2024
Published date
28-07-2013
Specifies on the geometrical parameters of the openings (i.e., holes) in thin silicon slices, within which the conductive vias will be constructed.
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