SEMI 3D5:2024
Current
Current
The latest, up-to-date edition.
Guide for Metrology Techniques to be Used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures
Available format(s)
Hardcopy
Language(s)
English
Published date
01-02-2024
€150.00
Excluding VAT
This Guide will assist the user in selection and use of tools for performing measurements of geometrical parameters of an individual through-silicon via (TSV), or of an array of TSVs.
| DocumentType |
Guide
|
| Pages |
0
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| Supersedes |
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