SEMI 3D6 : 2013
Current
Current
The latest, up-to-date edition.
GUIDE FOR CMP AND MICRO-BUMP PROCESSES FOR FRONTSIDE THROUGH SILICON VIA (TSA) INTEGRATION
Published date
09-10-2013
Gives a generic middle-end process flow to define acceptable TSV and CMP quality criteria as well as to develop methodology and measuring procedures for micro-bump.
Sorry this product is not available in your region.
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.