SEMI 3D9:2014(R2020)
Current
Current
The latest, up-to-date edition.
Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stack
Available format(s)
Hardcopy
Language(s)
English
Published date
01-04-2020
€125.00
Excluding VAT
This Guide is intended to address the needs of the 3D Stacked IC (3DS-IC) industry by providing the tools needed to procure wafer stacks to be used in a 3DS-IC process.
| DocumentType |
Guide
|
| Pages |
0
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| Supersedes |
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