SEMI E137 : 2005(R2018)E
Current
Current
The latest, up-to-date edition.
GUIDE FOR FINAL ASSEMBLY, PACKAGING, TRANSPORTATION, UNPACKING, AND RELOCATION OF SEMICONDUCTOR MANUFACTURING EQUIPMENT
Published date
12-01-2013
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Provides guidelines for activities specific to the final assembly and packaging at the supplier's facility, transportation, and unpacking and relocation of semiconductor manufacturing equipment (SME) to the customer's cleanroom manufacturing area.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. Supersedes SEMI E49.1. (10/2004) E = This standard was editorially modified in January 2018 to correct editorial errors. (01/2018)
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| DocumentType |
Standard
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| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Current
|
| SEMI F63 : 2016 | GUIDE FOR ULTRAPURE WATER USED IN SEMICONDUCTOR PROCESSING |
| SEMI C41 : 2005 | SPECIFICATIONS AND GUIDELINES FOR 2-PROPANOL |
| SEMI E49.2 : 2017 | GUIDE FOR THE QUALIFICATION OF POLYMER ASSEMBLIES USED IN ULTRAPURE WATER AND LIQUID CHEMICAL SYSTEMS IN SEMICONDUCTOR PROCESS EQUIPMENT |
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