SEMI E137 : 2005(R2018)E
Current
Current
The latest, up-to-date edition.
GUIDE FOR FINAL ASSEMBLY, PACKAGING, TRANSPORTATION, UNPACKING, AND RELOCATION OF SEMICONDUCTOR MANUFACTURING EQUIPMENT
Published date
12-01-2013
Provides guidelines for activities specific to the final assembly and packaging at the supplier's facility, transportation, and unpacking and relocation of semiconductor manufacturing equipment (SME) to the customer's cleanroom manufacturing area.
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