• SEMI E76 : 1999(R2013)

    Current The latest, up-to-date edition.

    GUIDE FOR 300 MM PROCESS EQUIPMENT POINTS OF CONNECTION TO FACILITY SERVICES

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    Published date:  12-01-2013

    Publisher:  Semiconductor Equipment & Materials Institute

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    Abstract - (Show below) - (Hide below)

    Specifies strategies to support the device manufacturer's ability to pre-facilitate the utility point of connection (UPOC).

    General Product Information - (Show below) - (Hide below)

    Development Note Not available for sale from ILI, customer to contact SEMI. (05/2001) Supersedes SEMI PR2. (09/2005)
    Document Type Standard
    Publisher Semiconductor Equipment & Materials Institute
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    SEMI E149 : 2014 GUIDE FOR EQUIPMENT SUPPLIER-PROVIDED DOCUMENTATION FOR THE ACQUISITION AND USE OF MANUFACTURING EQUIPMENT
    SEMI F107 : 2009 GUIDE FOR PROCESS EQUIPMENT ADAPTER PLATES
    SEMI E6 : 2014 GUIDE FOR SEMICONDUCTOR EQUIPMENT INSTALLATION DOCUMENTATION

    Standards Referencing This Book - (Show below) - (Hide below)

    SEMI S2 : 2016B ENVIRONMENTAL, HEALTH, AND SAFETY GUIDELINE FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT
    SEMI E6 : 2014 GUIDE FOR SEMICONDUCTOR EQUIPMENT INSTALLATION DOCUMENTATION
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