SEMI G1 : 1996

Defines the acceptance criteria and materials for the components (window frames, bases, and caps) or sub-assemblies (leadframes mounted in a sandwich between bases and window frames) used for cerdip package constructions. Applies to all cerdip (dual-in- line) packages which have either: a leadframe sandwiched between two ceramic pieces - the base and a window frame - and sealed by a solder glass layer, and a cap with a similar seal; or a leadframe mounted into a solder glass layer on a ceramic base, and a cap with a similar glass seal layer.