SEMI G1 : 1996
Current
The latest, up-to-date edition.
SPECIFICATION FOR CERDIP PACKAGE CONSTRUCTIONS
12-01-2013
Defines the acceptance criteria and materials for the components (window frames, bases, and caps) or sub-assemblies (leadframes mounted in a sandwich between bases and window frames) used for cerdip package constructions. Applies to all cerdip (dual-in- line) packages which have either: a leadframe sandwiched between two ceramic pieces - the base and a window frame - and sealed by a solder glass layer, and a cap with a similar seal; or a leadframe mounted into a solder glass layer on a ceramic base, and a cap with a similar glass seal layer.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| SEMI G2 : 1994 | SPECIFICATION FOR METALLIC LEADFRAMES FOR CER-DIP PACKAGES |
| SEMI G24 : 1989(R2011) | TEST METHOD FOR MEASURING THE LEAD-TO-LEAD AND LOADING CAPACITANCE OF PACKAGE LEADS |
| SEMI G25 : 1989(R2011) | TEST METHOD FOR MEASURING THE RESISTANCE OF PACKAGE LEADS |
| SEMI G20 : 1996 | SPECIFICATION FOR LEAD FINISHES FOR PLASTIC PACKAGES (ACTIVE DEVICES ONLY) |
| SEMI G30 : 1988(R2011) | TEST METHOD FOR JUNCTION-TO-CASE THERMAL RESISTANCE MEASUREMENTS OF CERAMIC PACKAGES |
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