Customer Support: +353 (0)1 857 6730

Corporate Website About Us
  • There are no items in your cart
Please enter a keyword to search
Advanced search
Home
SEMI
SEMI G10 : 1996

SEMI G10 : 1996

Current

Current

The latest, up-to-date edition.

STANDARD METHOD FOR MECHANICAL MEASUREMENT OF PLASTIC PACKAGE LEADFRAMES

Published date

12-01-2013

Publisher

Semiconductor Equipment & Materials Institute

Method outlines standard mechanical measurement techniques for cut strip leadframes. Applies to all facilities that perform mechanical measurements on leadframes. Information provided herein is to enable the use of the following specifications: SEMI G9, SEMI G27, and SEMI G28.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

SEMI G51 : 1990(R2011) SPECIFICATION FOR PLASTIC MOLDED (METRIC) QUAD FLAT PACK LEADFRAMES
SEMI G28 : 1997(R2011) SPECIFICATION FOR LEADFRAMES FOR PLASTIC MOLDED S.O. PACKAGES
SEMI G19 : 1997 SPECIFICATION FOR DIP LEADFRAMES PRODUCED BY ETCHING
SEMI G47 : 1988 SPECIFICATION FOR PLASTIC MOLDED QUAD FLAT PACK LEADFRAMES
SEMI G41 : 2017 SPECIFICATION FOR DUAL STRIP SOIC LEADFRAME
SEMI G9 : 1989 SPECIFICATION FOR STAMPED LEADFRAMES FOR PLASTIC MOLDED DUAL-IN-LINE SEMICONDUCTOR PACKAGES
SEMI G27 : 1989 SPECIFICATION FOR LEADFRAMES FOR PLASTIC LEADED CHIP CARRIER (PLCC) PACKAGES

View more information
Sorry this product is not available in your region.

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.

Get in touch with us