SEMI G10 : 1996
Current
Current
The latest, up-to-date edition.
STANDARD METHOD FOR MECHANICAL MEASUREMENT OF PLASTIC PACKAGE LEADFRAMES
Published date
12-01-2013
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Method outlines standard mechanical measurement techniques for cut strip leadframes. Applies to all facilities that perform mechanical measurements on leadframes. Information provided herein is to enable the use of the following specifications: SEMI G9, SEMI G27, and SEMI G28.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
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| DocumentType |
Standard
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| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Current
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| SEMI G51 : 1990(R2011) | SPECIFICATION FOR PLASTIC MOLDED (METRIC) QUAD FLAT PACK LEADFRAMES |
| SEMI G28 : 1997(R2011) | SPECIFICATION FOR LEADFRAMES FOR PLASTIC MOLDED S.O. PACKAGES |
| SEMI G19 : 1997 | SPECIFICATION FOR DIP LEADFRAMES PRODUCED BY ETCHING |
| SEMI G47 : 1988 | SPECIFICATION FOR PLASTIC MOLDED QUAD FLAT PACK LEADFRAMES |
| SEMI G41 : 2017 | SPECIFICATION FOR DUAL STRIP SOIC LEADFRAME |
| SEMI G9 : 1989 | SPECIFICATION FOR STAMPED LEADFRAMES FOR PLASTIC MOLDED DUAL-IN-LINE SEMICONDUCTOR PACKAGES |
| SEMI G27 : 1989 | SPECIFICATION FOR LEADFRAMES FOR PLASTIC LEADED CHIP CARRIER (PLCC) PACKAGES |
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