SEMI G19 : 1997
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR DIP LEADFRAMES PRODUCED BY ETCHING
Published date
12-01-2013
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Provides guidelines for the production of DIP leadframes for plastic molded semiconductor packages produced by the etching process. Design guideline for etchers, packaging engineers, and mold manufacturers and has been developed to meet the requirements of automatic bonders.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| SEMI G10 : 1996 | STANDARD METHOD FOR MECHANICAL MEASUREMENT OF PLASTIC PACKAGE LEADFRAMES |
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