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SEMI
SEMI G2 : 1994

SEMI G2 : 1994

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR METALLIC LEADFRAMES FOR CER-DIP PACKAGES

Published date

12-01-2013

Publisher

Semiconductor Equipment & Materials Institute

Defines the dimensions and materials for the metallic leadframe (stamped or etched) used in the construction of Cer-DIP Package. Criteria detailed applies to the iron-nickel leadframe (MIL-M- 38510 Type A or Type B) used in Cer-DIP packages.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

SEMI G44 : 1994 SPECIFICATION FOR LEAD FINISHES FOR GLASS TO METAL SEAL CERAMIC PACKAGES (ACTIVE DEVICES ONLY)
SEMI G1 : 1996 SPECIFICATION FOR CERDIP PACKAGE CONSTRUCTIONS

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