SEMI G2 : 1994
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR METALLIC LEADFRAMES FOR CER-DIP PACKAGES
Published date
12-01-2013
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Defines the dimensions and materials for the metallic leadframe (stamped or etched) used in the construction of Cer-DIP Package. Criteria detailed applies to the iron-nickel leadframe (MIL-M- 38510 Type A or Type B) used in Cer-DIP packages.
DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
|
DocumentType |
Standard
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PublisherName |
Semiconductor Equipment & Materials Institute
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Status |
Current
|
SEMI G44 : 1994 | SPECIFICATION FOR LEAD FINISHES FOR GLASS TO METAL SEAL CERAMIC PACKAGES (ACTIVE DEVICES ONLY) |
SEMI G1 : 1996 | SPECIFICATION FOR CERDIP PACKAGE CONSTRUCTIONS |
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