SEMI G20 : 1996
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR LEAD FINISHES FOR PLASTIC PACKAGES (ACTIVE DEVICES ONLY)
Published date
12-01-2013
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Defines lead finishes for plastic packages (e.g. single-in-line, dual-in-line, quad-in-line) using leadframes with SEMI-specified leadframe materials. Also defines the properties, composition, and limits and refers to the appropriate tests for utility.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| SEMI G35 : 1987 | SPECIFICATION FOR TEST METHODS FOR LEAD FINISHES ON SEMICONDUCTOR (ACTIVE) DEVICES |
| SEMI G1 : 1996 | SPECIFICATION FOR CERDIP PACKAGE CONSTRUCTIONS |
| SEMI G55 : 1993(R2011) | TEST METHOD FOR MEASUREMENT OF SILVER PLATING BRIGHTNESS |
| SEMI G4 : 2002 | SPECIFICATION FOR INTEGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES |
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