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SEMI G20 : 1996

SEMI G20 : 1996

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR LEAD FINISHES FOR PLASTIC PACKAGES (ACTIVE DEVICES ONLY)

Published date

12-01-2013

Publisher

Semiconductor Equipment & Materials Institute

Defines lead finishes for plastic packages (e.g. single-in-line, dual-in-line, quad-in-line) using leadframes with SEMI-specified leadframe materials. Also defines the properties, composition, and limits and refers to the appropriate tests for utility.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

SEMI G35 : 1987 SPECIFICATION FOR TEST METHODS FOR LEAD FINISHES ON SEMICONDUCTOR (ACTIVE) DEVICES
SEMI G1 : 1996 SPECIFICATION FOR CERDIP PACKAGE CONSTRUCTIONS

SEMI G55 : 1993(R2011) TEST METHOD FOR MEASUREMENT OF SILVER PLATING BRIGHTNESS
SEMI G4 : 2002 SPECIFICATION FOR INTEGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES

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