Name: SEMI G21 : 2017
Brand: SEMI
Availability: InStock

SPECIFICATION FOR PLATING INTEGRATED CIRCUIT LEADFRAMES

Published date

12-01-2013

Publisher

Semiconductor Equipment & Materials Institute

Defines the requirements for plating layers on leadframes intended for use at the upcoming inspection.

DevelopmentNote	Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType	Standard
PublisherName	Semiconductor Equipment & Materials Institute
Status	Current

SEMI G58 : 1994(R2011)	SPECIFICATION FOR CERQUAD PACKAGE CONSTRUCTIONS
SEMI G51 : 1990(R2011)	SPECIFICATION FOR PLASTIC MOLDED (METRIC) QUAD FLAT PACK LEADFRAMES
SEMI G28 : 1997(R2011)	SPECIFICATION FOR LEADFRAMES FOR PLASTIC MOLDED S.O. PACKAGES
SEMI G55 : 1993(R2011)	TEST METHOD FOR MEASUREMENT OF SILVER PLATING BRIGHTNESS
SEMI G47 : 1988	SPECIFICATION FOR PLASTIC MOLDED QUAD FLAT PACK LEADFRAMES
SEMI G64 : 1996(R2011)	SPECIFICATION FOR FULL-PLATED INTEGRATED CIRCUIT LEADFRAMES (AU, AG, CU, NI, PD/NI, PD)
SEMI G9 : 1989	SPECIFICATION FOR STAMPED LEADFRAMES FOR PLASTIC MOLDED DUAL-IN-LINE SEMICONDUCTOR PACKAGES
SEMI G27 : 1989	SPECIFICATION FOR LEADFRAMES FOR PLASTIC LEADED CHIP CARRIER (PLCC) PACKAGES

SEMI G4 : 2002

SPECIFICATION FOR INTEGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES

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SEMI G21 : 2017