SEMI G21 : 2017
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR PLATING INTEGRATED CIRCUIT LEADFRAMES
Published date
12-01-2013
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Defines the requirements for plating layers on leadframes intended for use at the upcoming inspection.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
|
| DocumentType |
Standard
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| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Current
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| SEMI G58 : 1994(R2011) | SPECIFICATION FOR CERQUAD PACKAGE CONSTRUCTIONS |
| SEMI G51 : 1990(R2011) | SPECIFICATION FOR PLASTIC MOLDED (METRIC) QUAD FLAT PACK LEADFRAMES |
| SEMI G28 : 1997(R2011) | SPECIFICATION FOR LEADFRAMES FOR PLASTIC MOLDED S.O. PACKAGES |
| SEMI G55 : 1993(R2011) | TEST METHOD FOR MEASUREMENT OF SILVER PLATING BRIGHTNESS |
| SEMI G47 : 1988 | SPECIFICATION FOR PLASTIC MOLDED QUAD FLAT PACK LEADFRAMES |
| SEMI G64 : 1996(R2011) | SPECIFICATION FOR FULL-PLATED INTEGRATED CIRCUIT LEADFRAMES (AU, AG, CU, NI, PD/NI, PD) |
| SEMI G9 : 1989 | SPECIFICATION FOR STAMPED LEADFRAMES FOR PLASTIC MOLDED DUAL-IN-LINE SEMICONDUCTOR PACKAGES |
| SEMI G27 : 1989 | SPECIFICATION FOR LEADFRAMES FOR PLASTIC LEADED CHIP CARRIER (PLCC) PACKAGES |
| SEMI G4 : 2002 | SPECIFICATION FOR INTEGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES |
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