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SEMI G24 : 1989(R2011)

SEMI G24 : 1989(R2011)

Current

Current

The latest, up-to-date edition.

TEST METHOD FOR MEASURING THE LEAD-TO-LEAD AND LOADING CAPACITANCE OF PACKAGE LEADS

Published date

12-01-2013

Publisher

Semiconductor Equipment & Materials Institute

Defines the materials, equipment, and procedures used to measure the lead-to-lead and loading capacitance of package leads. Semiconductor packages are given as examples; however, other packaging elements can be measured by this method.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

SEMI G58 : 1994(R2011) SPECIFICATION FOR CERQUAD PACKAGE CONSTRUCTIONS
SEMI G61 : 1994 SPECIFICATION FOR COFIRED CERAMIC PACKAGES
SEMI G1 : 1996 SPECIFICATION FOR CERDIP PACKAGE CONSTRUCTIONS

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