SEMI G25 : 1989(R2011)
Current
The latest, up-to-date edition.
TEST METHOD FOR MEASURING THE RESISTANCE OF PACKAGE LEADS
12-01-2013
Defines the materials, equipment, and procedure used to measure the resistance of leads in packaging elements. Uses a pin grid (cavity down) package as one example of the type of packaging element that can be measured with the method described within the document; however, the measurement technique may be applied to other geometrics with proper consideration.
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