SEMI G25 : 1989(R2011)
Current
Current
The latest, up-to-date edition.
TEST METHOD FOR MEASURING THE RESISTANCE OF PACKAGE LEADS
Published date
12-01-2013
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Defines the materials, equipment, and procedure used to measure the resistance of leads in packaging elements. Uses a pin grid (cavity down) package as one example of the type of packaging element that can be measured with the method described within the document; however, the measurement technique may be applied to other geometrics with proper consideration.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
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| DocumentType |
Standard
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| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Current
|
| SEMI G58 : 1994(R2011) | SPECIFICATION FOR CERQUAD PACKAGE CONSTRUCTIONS |
| SEMI G5 : 1987 | STANDARD FOR CERAMIC CHIP CARRIERS |
| SEMI G61 : 1994 | SPECIFICATION FOR COFIRED CERAMIC PACKAGES |
| SEMI G1 : 1996 | SPECIFICATION FOR CERDIP PACKAGE CONSTRUCTIONS |
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