SEMI G25 : 1989(R2011)
Current
The latest, up-to-date edition.
TEST METHOD FOR MEASURING THE RESISTANCE OF PACKAGE LEADS
12-01-2013
Defines the materials, equipment, and procedure used to measure the resistance of leads in packaging elements. Uses a pin grid (cavity down) package as one example of the type of packaging element that can be measured with the method described within the document; however, the measurement technique may be applied to other geometrics with proper consideration.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| SEMI G58 : 1994(R2011) | SPECIFICATION FOR CERQUAD PACKAGE CONSTRUCTIONS |
| SEMI G5 : 1987 | STANDARD FOR CERAMIC CHIP CARRIERS |
| SEMI G61 : 1994 | SPECIFICATION FOR COFIRED CERAMIC PACKAGES |
| SEMI G1 : 1996 | SPECIFICATION FOR CERDIP PACKAGE CONSTRUCTIONS |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.