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SEMI
SEMI G27 : 1989

SEMI G27 : 1989

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR LEADFRAMES FOR PLASTIC LEADED CHIP CARRIER (PLCC) PACKAGES

Published date

12-01-2013

Publisher

Semiconductor Equipment & Materials Institute

Provides guidelines for high volume production of leadframes for plastic leaded chip carrier semiconductor packages. Design guideline for leadframe stampers, packaging engineers, and mold manufacturers, and has been developed to meet the requirements of automatic assemblers.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

SEMI G21 : 2017 SPECIFICATION FOR PLATING INTEGRATED CIRCUIT LEADFRAMES
SEMI G10 : 1996 STANDARD METHOD FOR MECHANICAL MEASUREMENT OF PLASTIC PACKAGE LEADFRAMES
SEMI G4 : 2002 SPECIFICATION FOR INTEGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES

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