Customer Support: +353 (0)1 857 6730

Corporate Website About Us
  • There are no items in your cart
Please enter a keyword to search
Advanced search
Home
SEMI
SEMI G28 : 1997(R2011)

SEMI G28 : 1997(R2011)

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR LEADFRAMES FOR PLASTIC MOLDED S.O. PACKAGES

Published date

12-01-2013

Publisher

Semiconductor Equipment & Materials Institute

Defines acceptance criteria for stamped leadframes for plastic molded S.O. packages. Guideline for the production of stamped S.O. Leadframes to be used in plastic molded S.O. packages.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

SEMI G21 : 2017 SPECIFICATION FOR PLATING INTEGRATED CIRCUIT LEADFRAMES
SEMI G10 : 1996 STANDARD METHOD FOR MECHANICAL MEASUREMENT OF PLASTIC PACKAGE LEADFRAMES
SEMI G9 : 1989 SPECIFICATION FOR STAMPED LEADFRAMES FOR PLASTIC MOLDED DUAL-IN-LINE SEMICONDUCTOR PACKAGES
SEMI G4 : 2002 SPECIFICATION FOR INTEGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES

View more information
Sorry this product is not available in your region.

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.

Get in touch with us