SEMI G28 : 1997(R2011)
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR LEADFRAMES FOR PLASTIC MOLDED S.O. PACKAGES
Published date
12-01-2013
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Defines acceptance criteria for stamped leadframes for plastic molded S.O. packages. Guideline for the production of stamped S.O. Leadframes to be used in plastic molded S.O. packages.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| SEMI G21 : 2017 | SPECIFICATION FOR PLATING INTEGRATED CIRCUIT LEADFRAMES |
| SEMI G10 : 1996 | STANDARD METHOD FOR MECHANICAL MEASUREMENT OF PLASTIC PACKAGE LEADFRAMES |
| SEMI G9 : 1989 | SPECIFICATION FOR STAMPED LEADFRAMES FOR PLASTIC MOLDED DUAL-IN-LINE SEMICONDUCTOR PACKAGES |
| SEMI G4 : 2002 | SPECIFICATION FOR INTEGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES |
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