SEMI G30 : 1988(R2011)

Determines the thermal resistance of ceramic packages using thermal test chips. Deals only with junction-to-case or mounting surface measurements of thermal resistance and limits itself to heat sink and fluid bath testing environments. Following the outlined guidelines, junction-to-case thermal resistance measurements of ceramic packages using the heat sink and fluid bath methods should give the same results only under certain limited conditions, i.e., under conditions that approximate unidirectional heat flow through the chip and substrate to the preferred heat removal surface. If discrepancies occur, the heat sink mounting technique shall be considered as the referee test method.