SEMI G35 : 1987
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR TEST METHODS FOR LEAD FINISHES ON SEMICONDUCTOR (ACTIVE) DEVICES
Published date
12-01-2013
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Specification to be used by buyers and/or vendors of semiconductor (active) devices and is effective for all lead finishes used. Establishes uniform procedures and methods for conducting tests on lead finishes on (active device) electronic packages. Other SEMI standards establish materials used and the finishes for them.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| SEMI G44 : 1994 | SPECIFICATION FOR LEAD FINISHES FOR GLASS TO METAL SEAL CERAMIC PACKAGES (ACTIVE DEVICES ONLY) |
| SEMI G61 : 1994 | SPECIFICATION FOR COFIRED CERAMIC PACKAGES |
| SEMI G20 : 1996 | SPECIFICATION FOR LEAD FINISHES FOR PLASTIC PACKAGES (ACTIVE DEVICES ONLY) |
| SEMI G4 : 2002 | SPECIFICATION FOR INTEGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES |
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