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SEMI
SEMI G35 : 1987

SEMI G35 : 1987

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR TEST METHODS FOR LEAD FINISHES ON SEMICONDUCTOR (ACTIVE) DEVICES

Published date

12-01-2013

Publisher

Semiconductor Equipment & Materials Institute

Specification to be used by buyers and/or vendors of semiconductor (active) devices and is effective for all lead finishes used. Establishes uniform procedures and methods for conducting tests on lead finishes on (active device) electronic packages. Other SEMI standards establish materials used and the finishes for them.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

SEMI G44 : 1994 SPECIFICATION FOR LEAD FINISHES FOR GLASS TO METAL SEAL CERAMIC PACKAGES (ACTIVE DEVICES ONLY)
SEMI G61 : 1994 SPECIFICATION FOR COFIRED CERAMIC PACKAGES

SEMI G20 : 1996 SPECIFICATION FOR LEAD FINISHES FOR PLASTIC PACKAGES (ACTIVE DEVICES ONLY)
SEMI G4 : 2002 SPECIFICATION FOR INTEGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES

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