SEMI G4 : 2002
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR INTEGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES
Published date
12-01-2013
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Specification covers the special requirements for a metal strip to be used to fabricate integrated circuit leadframes by stamping.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
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| DocumentType |
Standard
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| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Current
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| SEMI G51 : 1990(R2011) | SPECIFICATION FOR PLASTIC MOLDED (METRIC) QUAD FLAT PACK LEADFRAMES |
| SEMI G28 : 1997(R2011) | SPECIFICATION FOR LEADFRAMES FOR PLASTIC MOLDED S.O. PACKAGES |
| SEMI G20 : 1996 | SPECIFICATION FOR LEAD FINISHES FOR PLASTIC PACKAGES (ACTIVE DEVICES ONLY) |
| SEMI G35 : 1987 | SPECIFICATION FOR TEST METHODS FOR LEAD FINISHES ON SEMICONDUCTOR (ACTIVE) DEVICES |
| SEMI G47 : 1988 | SPECIFICATION FOR PLASTIC MOLDED QUAD FLAT PACK LEADFRAMES |
| SEMI G41 : 2017 | SPECIFICATION FOR DUAL STRIP SOIC LEADFRAME |
| SEMI G64 : 1996(R2011) | SPECIFICATION FOR FULL-PLATED INTEGRATED CIRCUIT LEADFRAMES (AU, AG, CU, NI, PD/NI, PD) |
| SEMI G9 : 1989 | SPECIFICATION FOR STAMPED LEADFRAMES FOR PLASTIC MOLDED DUAL-IN-LINE SEMICONDUCTOR PACKAGES |
| SEMI G27 : 1989 | SPECIFICATION FOR LEADFRAMES FOR PLASTIC LEADED CHIP CARRIER (PLCC) PACKAGES |
| SEMI G21 : 2017 | SPECIFICATION FOR PLATING INTEGRATED CIRCUIT LEADFRAMES |
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