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SEMI G41 : 2017

SEMI G41 : 2017

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR DUAL STRIP SOIC LEADFRAME

Published date

12-01-2013

Publisher

Semiconductor Equipment & Materials Institute

Gives guideline for high volume production of leadframes, including internal package plating, for plastic molded Single Outline Integrated Circuit (SOIC) semiconductor packages.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

SEMI G10 : 1996 STANDARD METHOD FOR MECHANICAL MEASUREMENT OF PLASTIC PACKAGE LEADFRAMES
SEMI G4 : 2002 SPECIFICATION FOR INTEGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES

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