SEMI G41 : 2017
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR DUAL STRIP SOIC LEADFRAME
Published date
12-01-2013
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Gives guideline for high volume production of leadframes, including internal package plating, for plastic molded Single Outline Integrated Circuit (SOIC) semiconductor packages.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| SEMI G10 : 1996 | STANDARD METHOD FOR MECHANICAL MEASUREMENT OF PLASTIC PACKAGE LEADFRAMES |
| SEMI G4 : 2002 | SPECIFICATION FOR INTEGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES |
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