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SEMI G47 : 1988

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR PLASTIC MOLDED QUAD FLAT PACK LEADFRAMES

Published date

12-01-2013

Describes the acceptance criteria for leadframes designed for assembly of JEDEC registered publication 95 standard outlines for "Plastic Quad Flat Pack .025" lead spacing (gull wing) packages."

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

SEMI G21 : 2017 SPECIFICATION FOR PLATING INTEGRATED CIRCUIT LEADFRAMES
SEMI G10 : 1996 STANDARD METHOD FOR MECHANICAL MEASUREMENT OF PLASTIC PACKAGE LEADFRAMES
SEMI G4 : 2002 SPECIFICATION FOR INTEGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES

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