SEMI G47 : 1988
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR PLASTIC MOLDED QUAD FLAT PACK LEADFRAMES
Published date
12-01-2013
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Describes the acceptance criteria for leadframes designed for assembly of JEDEC registered publication 95 standard outlines for "Plastic Quad Flat Pack .025" lead spacing (gull wing) packages."
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| SEMI G21 : 2017 | SPECIFICATION FOR PLATING INTEGRATED CIRCUIT LEADFRAMES |
| SEMI G10 : 1996 | STANDARD METHOD FOR MECHANICAL MEASUREMENT OF PLASTIC PACKAGE LEADFRAMES |
| SEMI G4 : 2002 | SPECIFICATION FOR INTEGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES |
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