SEMI G51 : 1990(R2011)
Current
The latest, up-to-date edition.
SPECIFICATION FOR PLASTIC MOLDED (METRIC) QUAD FLAT PACK LEADFRAMES
12-01-2013
Defines acceptance criteria for leadframes designed for assembly of JEDEC-proposed registered Publication 95 Standard Outlines for the Metric Quad Flat Pack Family Packages. Design guideline for leadframe stampers and etchers, packaging engineers, and mold and trim/form tooling manufacturers. It has been developed to meet the requirements of assemblers using manual and automatic equipment.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
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| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Current
|
| SEMI G21 : 2017 | SPECIFICATION FOR PLATING INTEGRATED CIRCUIT LEADFRAMES |
| SEMI G10 : 1996 | STANDARD METHOD FOR MECHANICAL MEASUREMENT OF PLASTIC PACKAGE LEADFRAMES |
| SEMI G4 : 2002 | SPECIFICATION FOR INTEGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES |
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