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SEMI G58 : 1994(R2011)

SEMI G58 : 1994(R2011)

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR CERQUAD PACKAGE CONSTRUCTIONS

Published date

12-01-2013

Publisher

Semiconductor Equipment & Materials Institute

Defines acceptance criteria for Cerquad package components and includes requirements for the leadframe, base, window frame, cap and sealing glass materials. Applies to all Cerquad packages which have a leadframe sandwich between two ceramic pieces the base and the window frame and sealed by glass, and a cap with a similar glass seal.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

SEMI G21 : 2017 SPECIFICATION FOR PLATING INTEGRATED CIRCUIT LEADFRAMES
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