SEMI G58 : 1994(R2011)
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR CERQUAD PACKAGE CONSTRUCTIONS
Published date
12-01-2013
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Defines acceptance criteria for Cerquad package components and includes requirements for the leadframe, base, window frame, cap and sealing glass materials. Applies to all Cerquad packages which have a leadframe sandwich between two ceramic pieces the base and the window frame and sealed by glass, and a cap with a similar glass seal.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| SEMI G21 : 2017 | SPECIFICATION FOR PLATING INTEGRATED CIRCUIT LEADFRAMES |
| SEMI G24 : 1989(R2011) | TEST METHOD FOR MEASURING THE LEAD-TO-LEAD AND LOADING CAPACITANCE OF PACKAGE LEADS |
| SEMI G25 : 1989(R2011) | TEST METHOD FOR MEASURING THE RESISTANCE OF PACKAGE LEADS |
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