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SEMI G61 : 1994

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR COFIRED CERAMIC PACKAGES

Published date

12-01-2013

Describes the materials and acceptance criteria for high-temperature, cofired ceramic packages.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

SEMI G6 : 1989 TEST METHOD FOR SEAL RING FLATNESS
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SEMI G25 : 1989(R2011) TEST METHOD FOR MEASURING THE RESISTANCE OF PACKAGE LEADS
SEMI G8 : 1994 TEST METHOD FOR GOLD PLATING
SEMI G35 : 1987 SPECIFICATION FOR TEST METHODS FOR LEAD FINISHES ON SEMICONDUCTOR (ACTIVE) DEVICES
SEMI G30 : 1988(R2011) TEST METHOD FOR JUNCTION-TO-CASE THERMAL RESISTANCE MEASUREMENTS OF CERAMIC PACKAGES

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