SEMI G61 : 1994
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR COFIRED CERAMIC PACKAGES
Published date
12-01-2013
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Describes the materials and acceptance criteria for high-temperature, cofired ceramic packages.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| SEMI G6 : 1989 | TEST METHOD FOR SEAL RING FLATNESS |
| SEMI G24 : 1989(R2011) | TEST METHOD FOR MEASURING THE LEAD-TO-LEAD AND LOADING CAPACITANCE OF PACKAGE LEADS |
| SEMI G25 : 1989(R2011) | TEST METHOD FOR MEASURING THE RESISTANCE OF PACKAGE LEADS |
| SEMI G8 : 1994 | TEST METHOD FOR GOLD PLATING |
| SEMI G35 : 1987 | SPECIFICATION FOR TEST METHODS FOR LEAD FINISHES ON SEMICONDUCTOR (ACTIVE) DEVICES |
| SEMI G30 : 1988(R2011) | TEST METHOD FOR JUNCTION-TO-CASE THERMAL RESISTANCE MEASUREMENTS OF CERAMIC PACKAGES |
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