SEMI G64 : 1996(R2011)
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
SPECIFICATION FOR FULL-PLATED INTEGRATED CIRCUIT LEADFRAMES (AU, AG, CU, NI, PD/NI, PD)
16-12-2023
12-01-2013
Intended as a guideline for evaluating plating layer characteristics required by users of full-plated leadframes for plastic semiconductor packages. Full-plated leadframes have received attention in recent years as a possible solution to restrictions and challenges resulting from the effects of Pb on the environment, package reliability improvement due to the P.P.F. process, lead coplanarity on fine-pitched leadframes, and lead bridges with solder plating. The test procedures and specification detailed apply to full-plated leadframes.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
|
| DocumentType |
Standard
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| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Superseded
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| SupersededBy |
| SEMI G21 : 2017 | SPECIFICATION FOR PLATING INTEGRATED CIRCUIT LEADFRAMES |
| SEMI G55 : 1993(R2011) | TEST METHOD FOR MEASUREMENT OF SILVER PLATING BRIGHTNESS |
| SEMI G52 : 2015 | TEST METHOD FOR MEASUREMENT OF IONIC CONTAMINATION ON SEMICONDUCTOR LEADFRAMES |
| SEMI G4 : 2002 | SPECIFICATION FOR INTEGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES |
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