SEMI G64 : 1996(R2011)
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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SPECIFICATION FOR FULL-PLATED INTEGRATED CIRCUIT LEADFRAMES (AU, AG, CU, NI, PD/NI, PD)
16-12-2023
12-01-2013
Intended as a guideline for evaluating plating layer characteristics required by users of full-plated leadframes for plastic semiconductor packages. Full-plated leadframes have received attention in recent years as a possible solution to restrictions and challenges resulting from the effects of Pb on the environment, package reliability improvement due to the P.P.F. process, lead coplanarity on fine-pitched leadframes, and lead bridges with solder plating. The test procedures and specification detailed apply to full-plated leadframes.
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