SEMI G64:2018(R2023)
Current
Current
The latest, up-to-date edition.
Specification for Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd)
Available format(s)
Hardcopy
Language(s)
English
Published date
01-11-2023
Important note : Users cannot be edited or removed once added to your Multi user PDF.This Specification is intended as a guideline for evaluating plating layer characteristics required by users of full-plated leadframes for plastic semiconductor packages.
| DocumentType |
Standard
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| Pages |
0
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
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| Supersedes |
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