SEMI G66:1996(R2023)
Current
Current
The latest, up-to-date edition.
Test Method for the Measurement of Water Absorption Characteristics for Semiconductor Plastic Molding Compounds
Available format(s)
Hardcopy
Language(s)
English
Published date
01-08-2023
This Test Method describes a procedure for measuring the water absorption rate for plastic molding compounds and provides a method to calculate the diffusion and solubility coefficients, which are required to simulate the water absorption characteristics.
DocumentType |
Test Method
|
Pages |
0
|
PublisherName |
Semiconductor Equipment & Materials Institute
|
Status |
Current
|
Supersedes |
SEMI E5:2023 | Specification for SEMI Equipment Communications Standard 2 Message Content (SECS-II) |
SEMI E94 : 2014 | SPECIFICATION FOR CONTROL JOB MANAGEMENTT |
SEMI E40 : 2018 | Specification for Processing Management |
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