SEMI G8 : 1994
Current
Current
The latest, up-to-date edition.
TEST METHOD FOR GOLD PLATING
Published date
12-01-2013
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Test method describes procedures to determine gold plating quality. Methods apply to gold plating on cofired ceramic or metal packages. The hardness, grade, and thickness of the gold plating shall be specified per MIL-G-45204 unless otherwise agreed between customer and vendor.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| SEMI G5 : 1987 | STANDARD FOR CERAMIC CHIP CARRIERS |
| SEMI G61 : 1994 | SPECIFICATION FOR COFIRED CERAMIC PACKAGES |
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