SEMI G87 : 2008(R2020)
Current
Current
The latest, up-to-date edition.
Specification for Plastic Tape Frame for 300 mm Wafer
Available format(s)
Hardcopy
Language(s)
English
Published date
01-10-2020
The purpose of this Document is to standardize the specification of a plastic tape frame, for a 300 mm wafer, which is used between the dicing process and the die bonding process, and for the handling and shipping of wafers.
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