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SEMI G88 : 2011(R2017)

SEMI G88 : 2011(R2017)

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR TAPE FRAME FOR 450 MM WAFER

Published date

12-01-2013

Publisher

Semiconductor Equipment & Materials Institute

Regulates the specifications for 450 mm wafer tape frames used between the dicing process and the die-bonding process and also used for shipping and handling.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (03/2011)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

SEMI G92 : 2015 SPECIFICATION FOR TAPE FRAME CASSETTE FOR 450 MM WAFER
SEMI G95 : 2014 MECHANICAL INTERFACE SPECIFICATION FOR 450 MM LOAD PORT FOR TAPE FRAME CASSETTES IN THE BACKEND PROCESS

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