SEMI G88 : 2011(R2017)
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR TAPE FRAME FOR 450 MM WAFER
Published date
12-01-2013
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Regulates the specifications for 450 mm wafer tape frames used between the dicing process and the die-bonding process and also used for shipping and handling.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (03/2011)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| SEMI G92 : 2015 | SPECIFICATION FOR TAPE FRAME CASSETTE FOR 450 MM WAFER |
| SEMI G95 : 2014 | MECHANICAL INTERFACE SPECIFICATION FOR 450 MM LOAD PORT FOR TAPE FRAME CASSETTES IN THE BACKEND PROCESS |
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