SEMI G9 : 1989
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR STAMPED LEADFRAMES FOR PLASTIC MOLDED DUAL-IN-LINE SEMICONDUCTOR PACKAGES
Published date
12-01-2013
Sorry this product is not available in your region.
Provides guidelines for the stamping manufacture of leadframes for plastic molded dual-in-line semiconductor packages. Design guideline for leadframe stampers, packaging engineers and mold manufacturers, has been developed to meet requirements of automatic bonding.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| SEMI G28 : 1997(R2011) | SPECIFICATION FOR LEADFRAMES FOR PLASTIC MOLDED S.O. PACKAGES |
| SEMI G21 : 2017 | SPECIFICATION FOR PLATING INTEGRATED CIRCUIT LEADFRAMES |
| SEMI G10 : 1996 | STANDARD METHOD FOR MECHANICAL MEASUREMENT OF PLASTIC PACKAGE LEADFRAMES |
| SEMI G4 : 2002 | SPECIFICATION FOR INTEGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.