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SEMI
SEMI G9 : 1989

SEMI G9 : 1989

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR STAMPED LEADFRAMES FOR PLASTIC MOLDED DUAL-IN-LINE SEMICONDUCTOR PACKAGES

Published date

12-01-2013

Publisher

Semiconductor Equipment & Materials Institute

Provides guidelines for the stamping manufacture of leadframes for plastic molded dual-in-line semiconductor packages. Design guideline for leadframe stampers, packaging engineers and mold manufacturers, has been developed to meet requirements of automatic bonding.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

SEMI G28 : 1997(R2011) SPECIFICATION FOR LEADFRAMES FOR PLASTIC MOLDED S.O. PACKAGES

SEMI G21 : 2017 SPECIFICATION FOR PLATING INTEGRATED CIRCUIT LEADFRAMES
SEMI G10 : 1996 STANDARD METHOD FOR MECHANICAL MEASUREMENT OF PLASTIC PACKAGE LEADFRAMES
SEMI G4 : 2002 SPECIFICATION FOR INTEGRATED CIRCUIT LEADFRAME MATERIALS USED IN THE PRODUCTION OF STAMPED LEADFRAMES

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