SEMI G92 : 2015(R2020)
Current
Current
The latest, up-to-date edition.
Specification for Tape Frame Cassette for 450 mm Wafer
Available format(s)
Hardcopy
Language(s)
English
Published date
01-12-2020
Important note : Users cannot be edited or removed once added to your Multi user PDF.The purpose of this Standard is to specify mechanical features for the 450 mm wafer tape frame cassette used between the wafer mounting process and the die-bonding process.
| DocumentType |
Standard
|
| Pages |
0
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| Supersedes |
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