SEMI M23:2023
Current
Current
The latest, up-to-date edition.
Specification for Polished Monocrystalline Indium Phosphide Wafers
Available format(s)
Hardcopy
Language(s)
English
Published date
01-06-2023
Important note : Users cannot be edited or removed once added to your Multi user PDF.This Specification covers the substrate requirements for monocrystalline high-purity indium phosphide wafers used in semiconductor and electronic device manufacturing.
| DocumentType |
Standard
|
| Pages |
0
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| Supersedes |
| SEMI MF84:2012 | TEST METHOD FOR MEASURING RESISTIVITY OF SILICON WAFERS WITH AN IN-LINE FOUR-POINT PROBE |
| SEMI MF1392:2007 | TEST METHOD FOR DETERMINING NET CARRIER DENSITY PROFILES IN SILICON WAFERS BY CAPACITANCE-VOLTAGE MEASUREMENTS WITH A MERCURY PROBE |
| SEMI MF1390 : 2018 | TEST METHOD FOR MEASURING BOW AND WARP ON SILICON WAFERS BY AUTOMATED NONCONTACT SCANNING |
| SEMI MF671:2012 | TEST METHOD FOR MEASURING FLAT LENGTH ON WAFERS OF SILICON AND OTHER ELECTRONIC MATERIALS |
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