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SEMI M23:2023

Current

Current

The latest, up-to-date edition.

Specification for Polished Monocrystalline Indium Phosphide Wafers

Available format(s)

Hardcopy

Language(s)

English

Published date

01-06-2023

This Specification covers the substrate requirements for monocrystalline high-purity indium phosphide wafers used in semiconductor and electronic device manufacturing.

DocumentType
Standard
Pages
0
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current
Supersedes

SEMI MF84:2012 TEST METHOD FOR MEASURING RESISTIVITY OF SILICON WAFERS WITH AN IN-LINE FOUR-POINT PROBE
SEMI MF1392:2007 TEST METHOD FOR DETERMINING NET CARRIER DENSITY PROFILES IN SILICON WAFERS BY CAPACITANCE-VOLTAGE MEASUREMENTS WITH A MERCURY PROBE
SEMI MF1390 : 2018 TEST METHOD FOR MEASURING BOW AND WARP ON SILICON WAFERS BY AUTOMATED NONCONTACT SCANNING
SEMI MF671:2012 TEST METHOD FOR MEASURING FLAT LENGTH ON WAFERS OF SILICON AND OTHER ELECTRONIC MATERIALS

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