SEMI M40:2014(R2023)
Current
The latest, up-to-date edition.
Guide for Measurement of Roughness of Planar Surfaces on Polished Wafers
Hardcopy
English
01-10-2023
Important note : Users cannot be edited or removed once added to your Multi user PDF.This Guide incorporates the following methodologies: Standardized scan patterns for both local and full-area surface characterization, A set of roughness abbreviations that describe measurement conditions in a short-hand code, and Reference test methodologies for three generic types of roughness measuring instruments.
| DocumentType |
Standard
|
| Pages |
0
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| Supersedes |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.