SEMI M77 : 2021
Current
Current
The latest, up-to-date edition.
Test Method for Determining Wafer Near-Edge Geometry Using Roll-Off Amount, ROA
Available format(s)
Hardcopy
Language(s)
English
Published date
01-04-2021
Important note : Users cannot be edited or removed once added to your Multi user PDF.Wafer near-edge geometry can significantly affect the yield of semiconductor device processing.
| DocumentType |
Test Method
|
| Pages |
0
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| Supersedes |
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