SEMI MF1390:2018(R2023)
Current
The latest, up-to-date edition.
Test Method for Measuring Bow and Warp on Silicon Wafers by Automated Noncontact Scanning
Hardcopy
English
01-10-2023
This Test Method is suitable for measuring the bow and warp of wafers used in semiconductor device processing in the as-sliced, lapped, etched, polished, epitaxial or other layer condition and for monitoring thermal and mechanical effects on the bow and warp of wafers during device processing.
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