SEMI MF1390:2018(R2023)
Current
The latest, up-to-date edition.
Test Method for Measuring Bow and Warp on Silicon Wafers by Automated Noncontact Scanning
Hardcopy
English
01-10-2023
Important note : Users cannot be edited or removed once added to your Multi user PDF.This Test Method is suitable for measuring the bow and warp of wafers used in semiconductor device processing in the as-sliced, lapped, etched, polished, epitaxial or other layer condition and for monitoring thermal and mechanical effects on the bow and warp of wafers during device processing.
| DocumentType |
Test Method
|
| Pages |
0
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| Supersedes |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.