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SEMI MF533:2010(R2023)

Current

Current

The latest, up-to-date edition.

Test Method for Thickness and Thickness Variation of Silicon Wafers

Available format(s)

Hardcopy

Language(s)

English

Published date

01-10-2023

This Test Method covers measurement of the thickness of silicon wafers, polished or unpolished, and estimation of the variation in thickness across the wafer for both flatted and notched wafers.

DocumentType
Test Method
Pages
0
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current
Supersedes

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€158.61
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