SEMI MF533:2010(R2023)
Current
Current
The latest, up-to-date edition.
Test Method for Thickness and Thickness Variation of Silicon Wafers
Available format(s)
Hardcopy
Language(s)
English
Published date
01-10-2023
Important note : Users cannot be edited or removed once added to your Multi user PDF.This Test Method covers measurement of the thickness of silicon wafers, polished or unpolished, and estimation of the variation in thickness across the wafer for both flatted and notched wafers.
| DocumentType |
Test Method
|
| Pages |
0
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| Supersedes |
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