SEMI MF950:2007(R2023)
Current
Current
The latest, up-to-date edition.
Test Method for Measuring the Depth of Crystal Damage of a Mechanically Worked Silicon Wafer Surface by Angle Polished and Defect Etching
Available format(s)
Hardcopy
Language(s)
English
Published date
01-10-2023
Important note : Users cannot be edited or removed once added to your Multi user PDF.This Test Method covers a technique to measure the depth of damage, on or beneath the surface of silicon wafers prior to any heat treatment of the wafer.
| DocumentType |
Test Method
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| Pages |
0
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| Supersedes |
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