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SEMI MS5 : 2013

SEMI MS5 : 2013

Current

Current

The latest, up-to-date edition.

TEST METHOD FOR WAFER BOND STRENGTH MEASUREMENTS USING MICRO-CHEVRON TEST STRUCTURES

Published date

12-01-2013

Publisher

Semiconductor Equipment & Materials Institute

Helps the determination of the bond strength between two wafers using micro-chevron test structures.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (10/2007)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

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