SEMI MS5 : 2013
Current
Current
The latest, up-to-date edition.
TEST METHOD FOR WAFER BOND STRENGTH MEASUREMENTS USING MICRO-CHEVRON TEST STRUCTURES
Published date
12-01-2013
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Helps the determination of the bond strength between two wafers using micro-chevron test structures.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (10/2007)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| SEMI MS3 : 2015 | TERMINOLOGY FOR MEMS TECHNOLOGY |
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