SEMI P18 : 1992(R2004)
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR OVERLAY CAPABILITIES OF WAFER STEPPERS
Published date
12-01-2013
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Definitions for overlay capabilities of wafer steppers are established, consistent with the primary application of wafer stepper (i.e. manufacture of very large scale integrated circuits). Included also are definitions for associated parameters: exposure field, registration, alignment and good fields.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
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| DocumentType |
Standard
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| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Current
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| 14/30317965 DC : 0 | BS EN 62903-2 ED.1 - PRINTED ELECTRONICS - EQUIPMENT - CONTACT PRINTING - RIGID MASTER - PART 2: MEASUREMENT METHOD OF PLATE MASTER PATTERN DIMENSION |
| IEC 62899-301-2:2017 | Printed electronics - Part 301-2: Equipment - Contact printing - Rigid master - Measurement method of plate master pattern dimension |
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