SEMI P47 : 2007(R2013)
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The latest, up-to-date edition.
TEST METHOD FOR EVALUATION OF LINE-EDGE ROUGHNESS AND LINEWIDTH ROUGHNESS
Published date
12-01-2013
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Describes standard procedures for calculating the indices for the following two kinds of line roughness to characterize materials and processes for fine line pattern fabrication, especially in the integrated circuit manufacturing environment.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (02/2007)
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| DocumentType |
Standard
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| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Current
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| 14/30317965 DC : 0 | BS EN 62903-2 ED.1 - PRINTED ELECTRONICS - EQUIPMENT - CONTACT PRINTING - RIGID MASTER - PART 2: MEASUREMENT METHOD OF PLATE MASTER PATTERN DIMENSION |
| IEC 62899-301-2:2017 | Printed electronics - Part 301-2: Equipment - Contact printing - Rigid master - Measurement method of plate master pattern dimension |
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| SEMI P19 : 1992(R2007) | SPECIFICATION FOR METROLOGY PATTERN CELLS FOR INTEGRATED CIRCUIT MANUFACTURE |
| SEMI P35 : 2006(R2013) | TERMINOLOGY FOR MICROLITHOGRAPHY METROLOGY |
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