SEMI T14 : 2005
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR MICRO ID ON 300 MM SILICON WAFERS
Published date
12-01-2013
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Describes a new means of identification with the Micro ID on 300 mm polished monocrystalline Silicon wafer with polished edge for process control.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (10/2004)
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| DocumentType |
Standard
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| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Current
|
| SEMI T17 :2006(R2018) | SPECIFICATION OF SUBSTRATE TRACEABILITY |
| SEMI T14.1 : 2005 | SPECIFICATION FOR THE MICRO ID OF SHORT VERTICAL DIMENSION ON 300 MM WAFER |
| SEMI T19 : 2011(R2017) | SPECIFICATION FOR DEVICE MARKING |
| SEMI PV81 : 2018 | GUIDE FOR SPECIFYING LOW PRESSURE HORIZONTAL DIFFUSION FURNACE |
| SEMI T1 : 1995(R2003) | SPECIFICATION FOR BACK SURFACE BAR CODE MARKING OF SILICON WAFERS |
| SEMI T7 : 2016 | SPECIFICATION FOR BACK SURFACE MARKING OF DOUBLE-SIDE POLISHED WAFERS WITH A TWO-DIMENSIONAL MATRIX CODE SYMBOL |
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