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SEMI T14 : 2005

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR MICRO ID ON 300 MM SILICON WAFERS

Published date

12-01-2013

Describes a new means of identification with the Micro ID on 300 mm polished monocrystalline Silicon wafer with polished edge for process control.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (10/2004)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

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SEMI T14.1 : 2005 SPECIFICATION FOR THE MICRO ID OF SHORT VERTICAL DIMENSION ON 300 MM WAFER
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SEMI T1 : 1995(R2003) SPECIFICATION FOR BACK SURFACE BAR CODE MARKING OF SILICON WAFERS
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