SEMI T7:2016(R2022)
Current
Current
The latest, up-to-date edition.
Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol
Available format(s)
Hardcopy
Language(s)
English
Published date
01-04-2022
Important note : Users cannot be edited or removed once added to your Multi user PDF.This Specification is intended to provide a marking symbology that can be used to mark silicon wafers with minimal intrusion into the fixed quality area of the wafer.
| DocumentType |
Revision
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| Pages |
0
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| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Current
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| Supersedes |
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