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SN EN 165000-4 : 1996

Current

Current

The latest, up-to-date edition.

FILM AND HYBRID INTEGRATED CIRCUITS - PART 4: CUSTOMER INFORMATION, PRODUCT ASSESSMENT LEVEL SCHEDULES AND BLANK DETAIL SPECIFICATION

Published date

12-01-2013

1 Introduction
1.1 How EN 165000 works
1.2 Customer/manufacturer interface
1.3 The product assessment level schedules
1.3.1 Derivation of the product assessment level
      schedules
1.3.2 Indication of applications for the product
      assessment level schedules
1.4 Test requirements of the PALS and their
      applicability to real life application
1.4.1 The origin of the inspection requirements
1.4.2 Electrical tests
1.4.3 Other screening tests
1.4.4 Device sample testing
1.4.5 Design evaluation testing
1.4.6 AQLs, inspection levels and sampling plans
2 Product assessment level schedules and detail
      specifications
      PALS 1-11
3 Blank detail specification requirements
      Front page for standard catalogue circuits
      Front page for customer circuits
      Section one - general data
      Section two - inspection requirements
      Example of a customer detail specification
Tables
1 PALS for solder or chip & wire (non-hermetic)
      assembly
2 PALS for chip and wire (hermetic) assembly

DocumentType
Standard
PublisherName
Swiss Standards
Status
Current

Standards Relationship
DIN EN 165000-4:1996-11 Identical
I.S. EN 165000-4:1998 Identical
EN 165000-4:1996 Identical
BS EN 165000-4:1996 Identical

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